HI-P INTERNATIONAL LIMITED (H17) SGD 1.99   +0.00% +0.00

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Dividend Yield(TTM) = 0.00%

If you find any of the dividend record is wrong or duplicated, please contact me.

Year	Yield	Total	Amount	Ex Date	Pay Date	Particulars
2020	1.01%	SGD 0.02	SGD0.02	2020-06-22	2020-07-01	Rate: SGD 0.02 Per Security
2019	0.40%	SGD 0.008	SGD0.008	2019-11-06	2019-11-18	Rate: SGD 0.008 Per Security
2017	9.75%	SGD 0.194	SGD0.19	2017-08-28	2017-09-11	SGD 0.19 ONE-TIER TAX
			SGD0.004	2017-05-11	2017-05-23	SGD 0.004 ONE-TIER TAX
2016	0.35%	SGD 0.007	SGD0.004	2016-11-14	2016-11-25	SGD 0.004 ONE-TIER TAX
			SGD0.003	2016-05-10	2016-05-20	SGD 0.003 ONE-TIER TAX
2015	0.65%	SGD 0.013	SGD0.003	2015-11-16	2015-11-27	SGD 0.003 ONE-TIER TAX
			SGD0.01	2015-05-05	2015-05-15	SGD 0.01 ONE-TIER TAX
2014	0.30%	SGD 0.006	SGD0.006	2014-05-05	2014-05-15	SGD 0.006 ONE-TIER TAX
2013	0.60%	SGD 0.012	SGD0.012	2013-05-02	2013-05-15	SGD 0.012 ONE-TIER TAX
2012	1.21%	SGD 0.024	SGD0.024	2012-04-25	2012-05-09	SGD 0.024 ONE-TIER TAX
2011	1.81%	SGD 0.036	SGD0.036	2011-05-03	2011-05-19	SGD 0.036 ONE-TIER TAX
2010	1.51%	SGD 0.03	SGD0.03	2010-05-11	2010-05-25	SGD 0.03 ONE-TIER TAX
2009	1.11%	SGD 0.022	SGD0.022	2009-04-29	2009-05-14	SGD 0.022 ONE-TIER TAX
2008	0.75%	SGD 0.015	SGD0.015	2008-04-25	2008-05-16	SGD 0.015 ONE-TIER TAX
2007	0.40%	SGD 0.008	SGD0.008	2007-04-24	2007-05-16	SGD 0.008 LESS TAX
2006	0.50%	SGD 0.01	SGD0.01	2006-04-28	2006-05-17	SGD 0.01 LESS TAX
2005	0.50%	SGD 0.01	SGD0.01	2005-05-06	2005-05-19	SGD 0.01 LESS TAX
2004	0.25%	SGD 0.005	SGD0.005	2004-05-06	2004-05-25	SGD 0.005 LESS TAX

Hi-P International Limited operates as a vertically integrated contract manufacturer serving the wireless telecommunications, consumer electronics and computing, and automotive industries. It operates through three segments: Precision Plastic Injection Molding; Mold Design and Fabrication; and Provision of Sub-Product Assembly and Full-Product Assembly Services. The company offers industrial and product design, manufacture, and assembly services; and ancillary value-added services, such as surface decoration finishing and precision metal stamping. It is also involved in the manufacture and sale of molds and special tools, related housing appliance plastic components and equipment, and water treatment equipment; plastic components and plastic product modules; mold base and components; electric components and electronic communication equipment; trays; in-mold decoration lenses; metal precision components; and metal and non-metal stampings, as well as provision of spray painting, engineering support, maintenance, and technology consultation services. In addition, the company is engaged in the design, development, and manufacture of automated machinery and equipment; purchase and sale of tools, molds, plastic and metal components, equipment, commodities, and scrap material; design and fabrication of dies; and manufacture, SMT, assembly, and trade of flexible printed circuit boards and flexible rigid printed circuit boards. It has operations primarily in the People's Republic of China, Poland, Singapore, Thailand, Taiwan, Europe, the United States, and the rest of Americas. The company was founded in 1980 and is headquartered in Singapore.